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我国集成电路测试技术现状及发展策略

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作者:俞建峰1, 陈翔2, 杨雪瑛2

作者单位:1. 江苏出入境检验检疫局机电产品检测中心, 江苏无锡 214101;
2. 无锡质量技术服务公司技术部, 江苏无锡 214101


关键词:集成电路; 设计验证; 晶圆测试; 芯片测试; 封装测试; 发展策略


摘要:

集成电路在现代电子整机中的应用比重已超过25%,测试是分析集成电路缺陷的最好工具,通过测试可以提高集成电路的成品率。通过分析我国集成电路产业现状,论述我国集成电路的设计验证测试、晶圆测试、芯片测试、封装测试等关键测试环节的技术水平,提出进一步发展我国集成电路测试产业的相关建议。


Current status on chinese integrated circuit testing technology and its development strategies

YU Jian-feng1, CHEN Xiang2, YANG Xue-ying2

1. Mechanical and Electrical Testing Center, Jiangsu Entry-Exit Quarantine & Inspection Bureau, Wuxi 214101, China;
2. Technology Department, Wuxi Quality Technology Service Company, Wuxi 214101, China

Abstract: At present, integrated circuits have occupied 25% of the whole electrical and electric equipments. And testing technologies are the best tools for analyzing the defections of the integrated circuits. In this article, the current status on Chinese integrated circuit industry was analyzed. And the key testing technologies including the design verification, wafer testing, chip testing, package testing were also presented. At last, strategies for developing testing technologies for Chinese integrated circuits were proposed.

Keywords: Integrated circuit; Design verification; Wafer testing; Chip testing; Package testing; Development strategies

2009, 35(3): 1-5  收稿日期: 2008-11-27;收到修改稿日期: 2009-2-16

基金项目: 国家质量监督检验检疫总局科技项目(2008IK078)

作者简介: 俞建峰(1974-),男,江苏宜兴市人,工程师,博士,主要从事机电测试等研究。

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