作者：赵汉伟, 陈诚, 王延来, 许全忠, 庞阔

作者单位：天津商业大学机械工程学院，天津 300134

关键词：柔性电子;三维数字图像相关;鼓泡变形;应变失配

摘要：

该文基于三维数字图像相关(3D-DIC)，提出定量表征柔性电子复合膜在三维鼓泡变形下应变失配程度的方法。首先，在柔性基底聚二甲基硅氧烷(PDMS)表面通过光刻、显影和转印工艺沉积马蹄形金属互连导线，制备柔性电子复合膜；之后，搭建三维鼓泡变形实验台，模拟实际工况下的弯曲载荷；最后，对不同弯曲载荷的复合膜进行三维应变场分析。结果表明：随着弯曲载荷的增加，样品呈现出应变大小交替分布的失配现象，且应变波动指数P值从1 kPa载荷条件下的0.0031增加到2.5 kPa载荷下的0.013，再减小到4.2 kPa载荷下的0.0094。该方法对柔性电子复合膜的应变失配程度进行有效量化表征，可对研究柔性电子的应变失配提供参考。

Experimental study on three-dimensional bubble deformation strain mismatch of flexible electronics
ZHAO Hanwei, CHEN Cheng, WANG Yanlai, XU Quanzhong, PANG Kuo
School of Mechanical Engineering, Tianjin University of Commerce, Tianjin 300134, China
Abstract: This paper proposes a method based on three-dimensional digital image correlation (3D-DIC) to quantitatively characterize the degree of strain mismatch of flexible electronic composite film under three-dimensional bubbling deformation. First, a horseshoe-shaped metal interconnect was deposited on the surface of a polydimethylsiloxane(PDMS) substrate through photolithography, development and transfer processes to prepare a flexible electronic composite film; then, a three-dimensional bubbling deformation experiment platform was built to simulate actual bending load under working conditions. Finally, the three-dimensional strain field analysis of the composite film with different bending loads was carried out. The results show that with the increase of the bending load, the sample exhibits a mismatch of alternate strain distribution, and the strain fluctuation index P value increases from 0.0031 under the pressure at 1 kPa to 0.013 under 2.5 kPa, and then decreases to 0.0094 under 4.2 kPa. This method can effectively quantify the degree of strain mismatch of the flexible electronic composite film, and can provide a reference for studying the strain mismatch of flexible electronics.
Keywords: flexible electronics;three-dimensional digital image correlation;bubble deformation;strain mismatch
2022, 48(6):80-85  收稿日期: 2021-10-26;收到修改稿日期: 2021-12-29
基金项目: 国家自然科学基金（51805371）
作者简介: 赵汉伟（1995-），男，安徽蚌埠市人，硕士研究生，专业方向为机械强度测试及智能检测
参考文献
[1] YU X, XIE Z, YU Y, et al. Skin-integrated wireless haptic interfaces for virtual and augmented reality[J]. Nature, 2019, 575(7783): 473-479
[2] JIN X, CHANG X D, WANG W Y, et al. Research Progress in Flexible Wearable Strain Sensors Based on Polydimethylsiloxane[J]. Journal of Materials Engineering, 2018, 46(11): 13-24
[3] YAN Z G, WANG B L, WANG K F. Thermal effects on the structural response of planar serpentine interconnects[J]. International Journal of Mechanical Sciences, 2017, 135: 23-30
[4] CHENG T, ZHANG Y, LAI W, et al. Stretchable Thin-Film Electrodes for Flexible Electronics with High Deformability and Stretchability[J]. Advanced Materials, 2015, 27(22): 3349-3376
[5] NEGGERS J, HOEFNAGELS J P M, HILD F, et al. A Global Digital Image Correlation Enhanced Full-Field Bulge Test Method[J]. Procedia Iutam, 2012, 4: 73-81
[6] LI C, LIU Z, XIE H. Novel scanning electron microscope bulge test technique integrated with loading function[J]. Review of Scientific Instruments, 2014, 85(10): 238-173
[7] YANG L, LONG S G, MA Z S, et al. Accuracy analysis of plane-strain bulge test for determining mechanical properties of thin films[J]. Transactions of Nonferrous Metals Society of China, 2014, 24(10): 3265-3273
[8] 王龙飞. 柔性电子PVDF传感器应力应变分析[J]. 机械与电子, 2019, 37(8): 36-39
[9] CHEN C, GU W, CHEN R, et al. Effect of nano-SiO2 hybridization of PDMS substrate on strain mismatch of flexible electronic film[J]. Applied Physics Letters, 2020, 116(22): 221901
[10] 陈少轩, 陈诚, 张宏儒. 复合柔性电子变形失配数字图像相关研究[J]. 电子测量与仪器学报, 2020, 34(6): 48-53
[11] 尤威, 梁晋, 梁瑜, 等. 基于数字图像相关法的H340LAD_Z高强度钢屈服行为研究[J]. 中国测试, 2017, 43(12): 119-123
[12] 褚玉龙, 张长田, 潘雪纯, 等. 航空GH2036合金硬度热处理优化及疲劳性能DIC分析[J]. 中国测试, 2020, 46(2): 148-154
[13] 张鹏飞, 刘然, 沈功田, 等. 基于声发射和数字图像相关方法的承人夹层玻璃损伤破坏研究[J]. 中国测试, 2021, 47(12): 39-46
[14] ZHANG X, YONG W, JIA Y, et al. Deformation analysis of ferrite/pearlite banded structure under uniaxial tension using digital image correlation[J]. Optics and Lasers in Engineering, 2016, 85: 24-28